The 2016 South China International Circuit Board and Electronic Assembly Exhibition was grandly opened in Hall 1, 2 and 4 of Shenzhen Convention and Exhibition Center on December 7, and continued to be displayed until December 9. Since its establishment, the exhibition has grown for 15 years and has now developed into one of the most influential commercial platforms in the global circuit board and electronic assembly industry. The theme of this exhibition is "Global Wisdom Gathering, Leading the Future", and the scale is even larger than before.

Prevent mutual heat transfer printing between FPC products, reduce operating procedures, improve work efficiency, control solder pads and gold finger overflow (can be controlled below 2mil). The product is free of silicone oil and plasticizers to prevent secondary pollution of FPC.