In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

In PCB manufacturing, thickness uniformity is more than a cosmetic requirement. It affects impedance control, lamination stability, assembly reliability, and overall yield. Even small variations in board thickness can create problems during fine-line imaging, solder mask application, and final assembly. One effective way to improve thickness uniformity is through the use of conformal film in the lamination process. A PCB is built from multiple layers of copper, resin, and dielectric materials. During lamination, these layers are pressed together under heat and pressure. If resin flow is uneven, copper areas are unbalanced, or pressure distribution is inconsistent, the final board may show thickness variation.

In PCB lamination and hightemperature release processes, most engineers instinctively focus on peel force, temperature rating, and surface cleanliness. Yet the spec that quietly determines registration accuracy, adhesive squeezeout, and final yield is often low deformation at the XY direction. This is precisely where a good conformal release film earns its place in a layup. Below is a practical breakdown of what this property means, why it matters, and how to validate it on your own line. What Is a Conformal Release Film? A conformal release film is a hightemperature functional film that performs two jobs simultaneously: 1.Conformability – Under heat and pressure, it softens enough to flow into surface topography (stepped circuits, coverlay openings, rigidflex transitions, bumped or molded surfaces), equalizing pressure in the Zaxis without trapping air. 2.Release – Its surface (fluoropolymer, siliconefree modified polyester, or PTFEcomposite) provides controlled, clean detachment from adhesives and resins after cure, leaving little to no residue.

In manufacturing processes such as high-temperature bonding, hot press welding, module packaging, glass hot bending, and lithium battery forming, high-temperature buffer pads serve as a "transition layer" between equipment and workpieces, playing multiple roles such as insulation, cushioning, anti slip, and insulation. Although it is just a "gasket", its material, thickness, structure, and function directly affect product yield, tooling life, and even production line efficiency. Choosing the wrong one not only increases the scrap rate, but may also damage the equipment; Choosing the right one can achieve twice the result with half the effort.

In industries such as electronic manufacturing, display modules, soft board lamination, and lithium battery packaging, hot press bonding is one of the important processes to ensure product reliability and structural strength. However, due to the high temperature, high pressure, and strict requirements for alignment accuracy during the bonding process, even a slight mistake can lead to problems such as indentation, misalignment, blistering, and delamination, seriously affecting product yield. Among all the influencing factors, a commonly overlooked but crucial auxiliary material is gradually entering the field of engineers - high-temperature buffer pads.

With the rapid development of the new energy industry, lithium batteries are gradually penetrating into multiple fields such as consumer electronics, energy storage, and electric vehicles. In the manufacturing process of lithium batteries, the high-temperature process is crucial. From cell pressing, electrode baking, to module forming, every step cannot be separated from the precise cooperation of temperature control, pressure control, and material protection. The manufacturing process of lithium batteries can be roughly divided into electrode preparation, cell assembly, chemical capacity separation, and PACK module assembly. Several core processes involve high-temperature techniques, such as: Drying and rolling of polarizer: temperature controlled at around 80 ℃~150 ℃, involving heat treatment of coated polarizer;

In the modern mechanical industry, the stability, durability, and work efficiency of equipment are important factors that determine productivity. With the continuous development of mechanical equipment, the requirements for accuracy and performance are becoming increasingly high. During the long-term operation of mechanical equipment, especially in high load and high-speed environments, it is often affected by friction, vibration, and impact. These factors not only lead to equipment damage and increased wear, but may also cause noise pollution, affecting the working environment and the health of operators. Cushion pads, as an effective auxiliary material, play an important role in solving these problems.

In many industrial applications, equipment needs to operate in high-temperature environments, such as automotive manufacturing, electronic devices, aerospace, and other industries. High temperature not only affects the performance of equipment, but may also cause component damage, system failure, and even pose safety hazards. Therefore, choosing suitable cushioning pads, especially those made of high-temperature resistant materials, has become particularly important. Buffer pads not only provide effective shock absorption protection, but also maintain stable performance under high temperature conditions, avoiding equipment damage. In high temperature environments, the main task of the buffer pad is to ensure the stable operation of the equipment while avoiding damage caused by excessive temperature to the equipment. To meet this demand, high-temperature resistant materials are required for the buffer pad. Heat resistant materials have some basic characteristics, including high temperature stability, heat resistance, corrosion resistance, wear resistance, etc.

In modern industrial production, efficient operation and long lifespan of equipment are key factors in improving productivity. However, equipment will face problems such as friction, vibration, and impact during long-term and high load operation, which can lead to rapid wear and frequent failures, thereby increasing maintenance and repair costs. Therefore, reasonable selection and use of buffer pads have become an important means to reduce equipment maintenance costs.