In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

Peel force refers to the force required to remove the release film​ from the substrate, and its uniformity directly affects the quality and production efficiency of the product. Uniform peeling force can ensure the stability of the production process and avoid problems such as tearing, residue or uneven adhesion on the film surface. Especially in large-scale production, fluctuations in stripping force may lead to production line stagnation, material waste, and an increase in product failure rates. Therefore, ensuring uniform peeling force of the release film is the key to improving production efficiency, reducing costs, and enhancing product quality.

In modern electronic manufacturing, FPC has become an important material widely used in fields such as smartphones, wearable devices, and automotive electronics. Flexible circuit boards are gradually replacing traditional rigid circuit boards and becoming the preferred choice in the electronics industry due to their characteristics of being lightweight, flexible, and foldable. However, during the FPC production process, there may be issues such as material adhesion and surface damage, in which case the release film can play a crucial role as a key material. Release film can provide anti sticking and protective functions at multiple stages of manufacturing, ensuring the quality and production efficiency of FPC.

High temperature release film plays a crucial role in the production of composite materials. It not only helps improve production efficiency, but also ensures high quality and consistency of products.

In electronic manufacturing (PCB, PCBA), precise production processes and material selection are crucial for the performance and quality of the final product. High temperature release film​, as an important auxiliary material, is widely used in the field of electronic manufacturing due to its unique properties and functions. High temperature release films are usually made of high-temperature resistant materials such as silicone and polytetrafluoroethylene (PTFE). It is mainly used to prevent adhesion between processing materials and mold surfaces, ensuring the smoothness of the product surface and the ease of cleaning of the mold. In the electronic manufacturing industry, high-temperature release films are widely used, especially in processes involving high-temperature treatment and precision machining.

In electronic manufacturing (PCB, PCBA), precise production processes and material selection are crucial for the performance and quality of the final product. High temperature release film​, as an important auxiliary material, is widely used in the field of electronic manufacturing due to its unique properties and functions. High temperature release films are usually made of high-temperature resistant materials such as silicone and polytetrafluoroethylene (PTFE). It is mainly used to prevent adhesion between processing materials and mold surfaces, ensuring the smoothness of the product surface and the ease of cleaning of the mold. In the electronic manufacturing industry, high-temperature release films are widely used, especially in processes involving high-temperature treatment and precision machining.

In the process of automobile manufacturing, high-temperature release film plays a crucial role as an important auxiliary material. It can not only improve production efficiency, but also significantly

In modern industrial production, high-temperature release film is an important industrial material widely used in various processing techniques, such as hot pressing, welding, and coating. Its main function is to prevent the processing material from adhering to the mold surface in high temperature environments, thereby improving production efficiency and product quality. The performance stability of high-temperature release film largely depends on its production process.

In modern industrial manufacturing, production efficiency is an important indicator for measuring a company's competitiveness and profitability. Improving production efficiency can not only shorten production cycles and reduce costs, but also enhance product quality and customer satisfaction. High temperature release film, as a key industrial material, has become a secret weapon for improving production efficiency.