In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

Improving production efficiency is one of the key goals for enterprises to maintain competitiveness in modern manufacturing and industrial production. As an excellent auxiliary material, high-temperature buffer pads play an indispensable role in improving production efficiency with their unique insulation, shock absorption, and protective properties. This article will explore in depth how high-temperature buffer pads can help enterprises achieve higher efficiency in improving production from below aspects: temperature stability, shock absorption and isolation, equipment protection, maintenance cost reduction, environmental adaptability, and future development prospects.

As an important material in industrial, electronic, aerospace and other fields, the performance of high-temperature buffer pads directly affects the stability and safety of equipment. Choosing a suitable high-temperature buffer pad requires a detailed evaluation of its various performance data to ensure that it can achieve the expected results in actual use environments. Temperature resistance is the primary data for evaluating high-temperature buffer pads. Buffer pads made of different materials have different upper temperature limits, and the specific values depend on the characteristics of the materials. Generally speaking, the temperature resistance range of high-temperature buffering pads can be from -60 ° C to+300 ° C or even higher. When evaluating the temperature resistance performance, the thermal stability of the material under high temperature conditions can be determined by thermo-gravimetric analysis (TGA) or differential scanning calorimetry (DSC) to understand whether it will decompose or soften in high temperature environments. In addition, long-term temperature testing can be conducted in simulated environments in practical applications to ensure that the buffer pad can maintain its shape and elasticity under extreme temperatures, providing reliable protection for the equipment.

High temperature buffer pads​, as important industrial materials, are widely used in various fields such as electronics, automotive, aerospace, etc. With the advancement of technology and changes in market demand, the future development trend of high-temperature cushioning pads is becoming increasingly diversified, while also facing a series of challenges. Technological innovation will be the core driving force for the development of high-temperature cushioning pads. With the continuous advancement of intelligent manufacturing and automation technology, the production process of high-temperature buffer pads will become more efficient and precise. New molding technologies such as 3D printing are emerging, enabling manufacturers to produce more complex and refined cushion shapes. In addition, the application of smart materials is constantly being explored, such as self-healing materials that can automatically restore performance after damage, which will significantly improve the service life and reliability of high-temperature cushioning pads. Therefore, technological innovation will continuously expand the performance and application fields of high-temperature cushioning pads.

High temperature buffer pads have become an indispensable component in modern industrial and electronic devices due to their unique performance and wide range of applications. Its manufacturing process involves the use of various technologies and materials to ensure that the cushion can effectively function in high-temperature environments. The following introduces the manufacturing process of high-temperature buffer pads, which is divided into six parts: material selection, forming process, surface treatment, quality control, production process, and product upgrade.

High temperature buffer pads play an important role in industries, automobiles, and electronics. Choosing the appropriate material is crucial for ensuring the performance of the cushioning pad. Below, we will introduce 10 common high-temperature cushion materials, analyze their characteristics and applicable scenarios, and help you make wise decisions.

High temperature buffer pads play a vital role in the automotive industry and their functions and applications are expanding as technology advances and automotive designs become more complex. These pads not only improve the performance and safety of automobiles, but also extend the life of components.

Before choosing a high-temperature buffer pad, it is important to understand its basic functions and characteristics. The main function of a high-temperature buffer pad is to absorb impact, provide insulation, and shock absorption. They are usually made of high temperature resistant materials, such as silica gel, heat resistant foam, ceramics, etc. Different materials have different temperature resistance and physical properties, suitable for different application scenarios. Understanding these fundamental knowledge can help you better evaluate options in the market.

The working principle of high-temperature buffer pads​ mainly depends on the characteristics of their materials and structural design. Generally speaking, these pads are made of high temperature resistant materials, such as silica gel, heat resistant foam and ceramics. These materials can withstand temperatures up to several hundred degrees without deformation or degradation. When the high-temperature buffer pad is subjected to external impact, its internal molecules will undergo displacement, thereby absorbing the impact force and reducing damage to the underlying equipment by dispersing and delaying the impact energy. In addition, these materials also have excellent thermal insulation properties, which can effectively prevent the conduction of heat and protect equipment from overheating.