In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

In the high-precision PCB manufacturing process, lamination is one of the core processes that affect the final product quality. However, common issues such as bubbling, warping, delamination, and copper surface damage during lamination often perplex engineers. Beyond stack-up design, equipment parameters, and lamination programs, there is another easily overlooked "hidden contributor" playing a crucial role—namely, the lamination cushion pad. The PCB lamination process is essentially a thermal compression bonding process: multiple layers of materials (such as copper foil, core boards, prepreg, etc.) are bonded under high temperature and pressure to form a complete multi-layer circuit board structure.

In the manufacturing of multi-layer PCBs, the success or failure of the lamination process directly determines the yield and performance stability of the product. In the lamination process, a crucial auxiliary material that is easily overlooked is the compression cushion pad (Cushion Pad/Press Pad), which often determines whether the finished board is "flat, non foaming, and non pressure damaged". This article will systematically explain "how to choose a cushion pad" from five aspects: the principle of cushion pad, material selection, matching strategy, common problems, and selection suggestions. It will help you improve the quality of compression and make your multi-layer board more stable and flat!

In the PCB manufacturing process, the most commonly focused aspects are typically "key process steps" such as etching accuracy, lamination stability, conductivity quality, and AOI inspection. However, a "minor player"—the release film—often goes overlooked. In fact, although the release film does not directly participate in circuit conduction, it plays an indispensable role in multiple stages, including dry film lamination, pattern transfer, lamination alignment, and finished product protection. If this film is not chosen properly, it may lead to issues such as film blistering, pattern misalignment, lamination delamination, surface scratches, and ultimately result in batch rework and yield reduction. So, how exactly does a "good" roll of release film help improve PCB manufacturing yield?

In high-precision manufacturing fields such as electronic die-cutting, FPC processing, OCA lamination, display module assembly, and semiconductor material transfer, release film serves as a "surface carrier," consistently positioned at the forefront of the production process. Although it does not directly form part of the product, it plays an extremely critical role in the manufacturing process—supporting, isolating, positioning, and protecting. Behind all these functions, "cleanliness" stands as the core foundation ensuring the stable operation of all processes.

In the daily production of industries such as electronic die-cutting, FPC manufacturing, label backing, optical bonding, etc., "release film residue" is a common and headache problem. It not only pollutes the surface of the product, but also causes poor die-cutting, bonding failure, functional abnormalities, and even leads to customer complaints and large-scale rework. However, truly solving the problem of residual glue is not as easy as simply changing a roll of film. Many engineers and procurement personnel often blame "poor film quality" and "too sticky glue" when encountering problems, but overlook the details hidden behind the process, formula, environmental control, and so on. Whether a release film has residual adhesive is actually the result of the coupling of multiple factors such as material system and process conditions. This article will provide in-depth analysis from below perspectives to help you systematically solve the pain point of "resin residue".

Release film is widely used in various industries such as electronic die-cutting, label backing, optical bonding, FPC lamination, protective film, etc. It is a "invisible assistant" for the processing of many adhesive materials. However, many companies often only focus on peel strength when purchasing or developing release films, neglecting a more fundamental selection factor - the substrate. The different substrate materials (such as PET, PE, BOPP, CPP, etc.) directly determine the mechanical properties, thermal stability, processing adaptability, and final use effect of the release film.

In industries such as electronic die-cutting, labels, protective films, PCBs, and optical materials, release film is an indispensable functional material. The "peel force," as one of the most critical performance indicators of release film, directly determines whether it can efficiently match adhesive materials, whether it can peel smoothly, and whether it will cause adhesive residue or product defects. Choosing the wrong peel force not only affects yield rates but also leads to process rework and cost wastage.

With the continuous development of electronic devices towards miniaturization, high density, and high precision, the importance of electronic die-cutting technology is increasing day by day. In the entire die-cutting process, release film plays a crucial role as an "auxiliary carrier" for adhesive materials. High quality release film not only affects the die-cutting accuracy and yield of products, but also directly affects the stability and efficiency of the entire automated processing. So, among numerous release film products, how can companies choose high-precision release films that are truly suitable for electronic die-cutting? The most commonly used release film substrates in electronic die-cutting are PET (polyester film), BOPP (biaxially oriented polypropylene), PE (polyethylene), etc. Among them, PET substrates are widely used due to their high strength, high temperature stability, and good size control ability, especially suitable for application scenarios that require high die-cutting accuracy and strong carrier stiffness.