In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

The rapid development of the new energy industry has led to the continuous expansion of the application of PI protective films in fields such as lithium batteries, super capacitors, and photovoltaic modules. Its high temperature stability, excellent electrical insulation, and chemical corrosion resistance make it the core protective material for new energy products

In modern industrial manufacturing, the selection of materials plays a crucial role in product performance and reliability. PI (Polyimide) protective film is widely used in multiple high-tech industries due to its excellent high temperature resistance, insulation, chemical corrosion resistance, and high mechanical strength. PI protective film plays an irreplaceable role in fields such as PCB, LCD,etc.

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High temperature release film, as an important auxiliary material, plays a crucial role in many industrial fields, especially in composite materials, automotive, aerospace, and electronic manufacturing industries. These film materials not only need to have excellent high temperature resistance and release properties, but also meet various requirements such as high efficiency, environmental protection, and economy. With the continuous development of the global manufacturing industry and the increasing demand for high-performance composite materials, how to improve the performance of high-temperature release films and expand their application scope has become a focus of attention for the industry and researchers.

High temperature release film plays an important role in modern manufacturing, especially in composite materials and high-temperature curing processes. As a demolding and protective material, it is widely used in various fields such as aerospace, automotive manufacturing, and wind power generation. However, the use of resins and solvents poses significant chemical resistance challenges to high-temperature release films. In high-temperature environments, many resins and solvents have strong corrosives and high viscosity. If high-temperature release films cannot effectively resist the erosion of these chemicals, it will not only affect the demolding effect, but may also lead to film damage or performance degradation. High temperature release film is commonly used for demolding protection during high-temperature curing processes. Its main function is to prevent resin from adhering to molds or other surfaces, thereby ensuring smooth demolding of composite materials and other products. During this process, the high-temperature release film not only needs to withstand high temperature environments, but also must have the ability to resist resin and solvent erosion. To meet these requirements, the selection of high-temperature release films is usually based on the chemical stability, thermal stability, and solvent resistance of their materials.

High-temperature release film, as an important auxiliary material, plays a crucial role in many industrial applications, especially in the fields of composite material molding, automobile manufacturing, aerospace, and electronic equipment production. Its main function is to prevent resin, glue, and other materials from adhering to the mold surface, ensuring smooth releasing. The high-temperature resistance of release film is one of the key factors for its successful application in many high-temperature processes. Different types of high-temperature release films have different temperature limits. So, what is the maximum temperature that the release film can withstand?

The aerospace industry is a field that demands extremely high material performance, especially in the use of composite materials, which must meet stringent quality and technical standards. In the design and manufacturing process of aerospace vehicles, the application of composite materials is becoming increasingly widespread, especially in key parts such as air frames, wings, and engine components. High-temperature release film, as a thin film material that can effectively prevent substance adhesion in high-temperature environments, plays a crucial role in the aerospace industry.

In modern manufacturing, especially in fields demanding high precision and performance such as composite materials, aerospace, automotive, and electronics, high-temperature release films play a crucial role as key auxiliary materials. Their primary function is to prevent adhesion between molds and substrates during high-temperature curing, ensuring that the final product has a smooth and flawless surface. Therefore, selecting the appropriate high-temperature release film becomes a key aspect in enhancing production efficiency and product quality.