The high temperature resistant release film has three layers of structure: one is the base paper, the second is the coating, and the third is silicone oil.

Release film, also known as isolation paper. Double silicon release film is a release film made by applying release agent to the original paper after overpressure. The weight is about 60g to 200g. Its range of use is mostly adhesive, which is a common industrial paper with anti stick function to prevent items from sticking together, and is mostly used in the electronic industry.

There are hundreds of types of release films based on product performance and usage, and non industry personnel and professionals are unaware of their usage. How to choose a suitable product for high-temperature release film, which can effectively block products. In addition to tablets, there is also a roll type of paper commonly used in the packaging industry. Its characteristics are: waterproof, oil proof, often used in chemical, electronic, automotive foam, printing and other industries. Release film, coated paper, and silicone oil paper with printing must be printed first before completing the next process: coating and silicon coating.

The high-temperature release membrane should meet the following requirements: it can adhere to the prepreg, but is easy to separate; Not reacting chemically with or contaminating the resin system; When the environmental temperature and humidity change, the length and width of the high-temperature release film should be kept constant to avoid wrinkling of the release film and causing wrinkling of the prepreg; It should have sufficient density to prevent water from entering the prepreg; The elongation of the release film after traction should be consistent with the fiber to prevent deformation or distortion due to asynchronous traction during the preparation process; Its thickness and mass per unit area are difficult to accurately control.

Reechas Technology is a national high-tech enterprise that integrates research and development, production, and sales. Since its establishment in 2006, the company has relied on advanced research and production advantages to provide various types of release film materials, functional film hot pressing materials, compression buffer materials, circuit board auxiliary materials, etc. for various fields such as hard PCB, soft FPC, soft hard combination boards, 5G circuit boards, packaging substrates, CCL, new energy, smart cards, etc.