FAFPADS | Press Pads
Thickness: 1.0-6.0mm,customizable
Temperature: 220°C
Color: White
Application: Lamination of PCB, CCL
Overview
Replacement for Kraft Paper
FAFPADS is a compression pad with aramid fiber and transparent high temperature film. Aramid fiber has the characteristics of high temperature resistance and repeated hot pressing. It has the characteristics of high temperature resistance, high strength, anti-sticking and easy peeling. FAFPADS integrates the advantages of two kinds of composite materials. Relies on the anti-sticking effect of high temperature film, it can reduce the influence of foreign substances such as resin on the cushion. During the lamination process, it can accurately control the heat transfer and balance the pressure on the product surface. It is a buffer material with excellent performance widely used in lamination of PCB and CCL.
Features
- 01Anti-winkle, easy to clean
- 02Smooth surface and uniform weight
- 03Operating temperature up to 220 ℃
- 04Good heat resistance and precise thermal control
- 05No debris, improve lamination quality
- 06Compensate for abnormal pressure to ensure consistent and balanced pressure during the lamination process
- 07The surface of the buffer pad is free of any substances, improving production efficiency while greatly reducing quality risks
- 08Environmentally friendly, pollution-free, in compliance with relevant EU regulations
- 09Thickness: 1.0-6.0mm ,width and length can be customized
