SUPADS | Ultra High Temperature Resistant
Thickness: 1.0-6.0mm,customizable
Temperature: 400°C
Color: Brown, fiber
Application: Lamination of 5G board, Teflon board
Overview
Repeated Using Press Pads
SUPADS is a self-developed product by Reechas to replace well-know brand from USA. It is a repeated using pads with excellent performance and widely used in lamination of 5G communication board, LCP material, Teflon material and ultra-high temperature resistant material. It can accurately control the heat transfer and balance the pressure on the surface of the circuit board.
Performance Data
- 01Anti-winkle, easy to clean
- 02Smooth surface and uniform weight
- 03Operating temperature up to 400 ℃
- 04Compensate for abnormal pressure to ensure consistent and balanced pressure during the lamination process
- 05Environmentally friendly, pollution-free, in compliance with relevant EU regulations
