REEFILM |Ultra High Temperature Release Film
Thickness: 25/50 μm
Temperature: 340 oC
Color: Coffee
Application: Lamination of HDI Flex, LCP, PCB ,FPC, Rigid-Flex board
Overview
Ultra High Temperature Resistant
REEFILM is a release film with exceptional temperature resistance. It has good temperature resistance and release effect during the lamination process. Under high temperature and high pressure conditions, the release film exhibits excellent toughness, making it easy to peel off from the product without causing any damage to the product's surface. It is widely used in HDI Flex, LCP, PCB, FPC, Rigid-flexible boards, and other high-temperature resistant products.
Features
- 01Excellent release performance
- 02Ultra high temperature resistant
- 03Uniform thickness
- 04Easy to operate
- 05Easy to peeling off from the plate
- 06High cleanliness
- 07Low X-Y axis shrinkage
- 08Smooth surface finish
- 09Available in sheet or roll
- 10Support PIN hole process
- 11Environmental friendly
Performance Data
| Property | Unit | Value |
| Ratio | / | 1.42 |
| Mechanic | ||
| Tensile(MD/TD) | MPa | >160 |
| Operate Temp. | ℃ | 340 |
| Specification | ||
| Density | mm | 100~500 |
| Thickness | μm | 25-50μm |
| Length | customized | |
| Color | Coffee | |
| We can provide slicing and PIN positioning hole services according to customer needs (i.e., the sheet-shaped film that provides with accurate positioning PIN holes). Customers no longer need to arrange the slicing and drilling of PIN holes on the release film themselves, which can save a significant amount of costs, including site, machine, labor, power, slice scrapping, drilling scrapping, and other expenses. | ||
