REELON | High Temperature Release Film
Thickness: 25/50/80 μm
Temperature: 320 °C
Color: White
Application: Lamination of 5G board, TK material ,LCP material ,PCB ,FPC
Overview
High Temperature Resistant
REELON is a high-performance release film with temperature resistance up to 320°C with good conformal effect. It has no silicon oil residue on the product surface, no residue on separator plate and no contamination to vacuum system. It is widely used in 5G board, TK material ,LCP material ,PCB ,FPC lamination.
Features
- 01Good peeling of performance
- 02High temperature resistant
- 03Environmental and no residue
- 04Good conformal effect
Performance Data
| Property | Unit | Value | Test Standard | Remark |
| Appearance | / | No dirt, wrinkles, scratches | Visual | |
| Color | / | Matte,white | Visual | |
| Thickness μm | μm | 25/50/80 μm | Guage | |
| Operate Temp. | ℃ | 250 | RCX-NW-RSS-001 | |
| Elongation | % | ≥120 | GB/T 13022-1991 | |
| Tensile | MPa | ≥13 | GB/T 13022-1991 | |
| ※It is recommended that end users to make his own test to determine the material’s suitability for his particular use. The above test data are standard values for reference only and are not to be taken as acceptance criteria. | ||||
