RF3200 | High Temperature Release Film
Thickness: 25/36/50 μm
Temperature: 190 oC
Color: White, translucent
Application: Lamination of PCB, FPC, Rigid-Flex board
Overview
High Temperature Resistant
RF3200 is a high performance release film with good temperature resistance and release effect during the lamination process of circuit boards. Under high temperature and high pressure conditions, RF3200 has good toughness and can be easily peeled off from the product without affecting the surface of the product. It is a cost-effective material and widely used in the lamination of PCB, FPC , and rigid-flexible board.
Features
- 01Easy peeling off from product
- 02Ultra smooth surface finish
- 03High temperature resistant
Performance Data
| Property | Unit | Standard value | Testing Standards | Remarks |
| Appearance | / | No dirt, wrinkles, scratches | Visual inspection | |
| Colour | / | / | Visual inspection | |
| Thickness | μm | 25/36/50μm | Gauge | customizable |
| Width | Mm | 0-1320Mm | Micrometer | |
| Temperature | ℃ | two hundred | RCX-NW-RSS-001 | |
| tensile | MPa | ≥ 170 | GB/T 13022-1991 | |
| ※It is recommended that end users to make his own test to determine the material’s suitability for his particular use. The above test data are standard values for reference only and are not to be taken as acceptance criteria. | ||||
