REE2000 | Suitable for Brown Oxidized Board
Thickness: 30/50 μm
Temperature: 205 oC
Color: White, translucent
Application: Lamination of PCB, FPC, Rigid-Flex board
Overview
Suitable for Blind via Core Lamination after Brown Oxidization
REE2000 is a high-performance release film. During the lamination process of the product, it exhibits good temperature resistance and peeling effect. It is particularly suitable for blind via core lamination after brown oxidized, avoiding the issues of fragility and stickiness. Under high temperature and high pressure conditions, the release film exhibits good toughness and strong dimensional stability. The REE2000 heat-resistant release film is designed to replace US imported release film and is widely used in the lamination of PCB, FPC, rigid-flexible boards, etc
Features
- 01Good release performance
- 02High temperature resistant, up to 205 °C
- 03Suitable for blind via core lamination after brown oxidized
- 04Easy to peeling off from the plate
- 05Low X-Y axis shrinkage
- 06Available in sheet or roll
- 07Support PIN hole process
- 08Environmental friendly
Performance Data
| Property | Unit | Value |
| Ratio | / | ≥1.40 |
| Mechanic | / | |
| Tensile(MD/TD) | MPa | >100 |
| Operate Temp. | ℃ | 205 |
| Specification | ||
| Width | mm | maxmium 1090 |
| Thickness | μm | 30-50μm |
| Length | / | customized |
| Color | / | natural |
| We can provide slicing and PIN positioning hole services according to customer needs (i.e., the sheet-shaped release film that provides customers with accurate positioning PIN holes). Customers no longer need to arrange the slicing and drilling of PIN holes on the release film themselves, which can save a significant amount of costs, including site, machine, labor, power, slice scrapping, drilling scrapping, and other expenses. | ||
