REE2000 | Suitable for Brown Oxidized Board

Thickness: 30/50 μm

Temperature: 205 ^oC

Color: White, translucent

Application: Lamination of PCB, FPC, Rigid-Flex board

Inquiry Now

Overview

Suitable for Blind via Core Lamination after Brown Oxidization

REE2000 is a high-performance release film. During the lamination process of the product, it exhibits good temperature resistance and peeling effect. It is particularly suitable for blind via core lamination after brown oxidized, avoiding the issues of fragility and stickiness. Under high temperature and high pressure conditions, the release film exhibits good toughness and strong dimensional stability. The REE2000 heat-resistant release film is designed to replace US imported release film and is widely used in the lamination of PCB, FPC, rigid-flexible boards, etc

Features

01
Good release performance
02
High temperature resistant, up to 205 °C
03
Suitable for blind via core lamination after brown oxidized
04
Easy to peeling off from the plate
05
Low X-Y axis shrinkage
06
Available in sheet or roll
07
Support PIN hole process
08
Environmental friendly

Performance Data

Property	Unit	Value
Ratio	/	≥1.40
Mechanic	/
Tensile(MD/TD)	MPa	>100
Operate Temp.	℃	205
Specification
Width	mm	maxmium 1090
Thickness	μm	30-50μm
Length	/	customized
Color	/	natural
We can provide slicing and PIN positioning hole services according to customer needs (i.e., the sheet-shaped release film that provides customers with accurate positioning PIN holes). Customers no longer need to arrange the slicing and drilling of PIN holes on the release film themselves, which can save a significant amount of costs, including site, machine, labor, power, slice scrapping, drilling scrapping, and other expenses.