Shenzhen Reechas Technology

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What Are the Characteristics of High Temperature Press Pads?

The high-temperature cushion is developed and produced for the ultra-high temperature press currently used in the PCB industry. When the pressing temperature of the circuit board exceeds 260 ℃, the general auxiliary materials such as Kraft paper and cushion pad can no longer meet the pressing demand of high temperature, so higher temperature resistant fiber materials must be used. At present, this HIPADS high-temperature buffer pad has excellent temperature resistance and can meet the requirements of ultra-high temperature pressing. The advantages of high-temperature buffer pads are that the upper and lower release layers of the high-temperature buffer pad act as isolation plates at high temperatures, while the middle layer film plays an effective role in filling and blocking adhesive. Multilayer board, soft and hard combination board, soft board, and circuit board with large High- and low-level difference,

High temperature press pads  is developed and produced for the ultra-high temperature press currently used in the PCB industry. When the pressing temperature of the circuit board exceeds 260 ℃, the general auxiliary materials such as Kraft paper and buffer pad can no longer meet the pressing demand of high temperature, and higher temperature resistant fiber materials must be used. At present, this HIPADS high-temperature press pad has excellent temperature resistance and can meet the requirements of ultra-high temperature pressing.

Advantages of high-temperature press pads

The upper and lower release layers of the high-temperature pads act as isolation plates at high temperatures, while the intermediate layer film plays an effective role in filling and blocking adhesive. Multilayer boards, soft and hard bonding boards, soft boards, and circuit boards with large High- and low-level difference can play an effective role in buffering, coating, and glue resistance during hot pressing. The edge of the three-layer film is fixed, which can prevent the problem of staggered sliding plates during the pressing process. Compared to single sheet operation, it saves a lot of operation time and improves work efficiency. It can effectively alleviate the problems of side overflow, leakage, and board surface shrinkage that other brands in the market are prone to, improve the quality of circuit board pressing, reduce product scrap, and improve production efficiency.

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Characteristics of high temperature pads

1. Fiber stability in high-temperature environments: the compression temperature can reach 400 ℃, and the thermal decomposition temperature is 573 ℃ in a 5% weight loss state.

2. Excellent flame retardancy: Limiting oxygen index greater than 38%, permanent flame retardancy

3. Excellent chemical stability: Fiber materials have a unique aromatic structure, can withstand the corrosion of ordinary organic solvents and various compounds, and are easy to store

4. Excellent electrical performance: able to maintain good insulation performance in high temperature, high voltage, high humidity and other environments

5. Environmental protection and safety: Cushion material is environmentally friendly, non-toxic, and pollution-free

Reechas is a high-tech enterprise founded in 2006 and headquartered in Shenzhen, China. We focus on the development, production, and sales of integrated laminating products, including release films, conformal films, and press pads. These products are widely usedin PCB, FPC,  rigid-flex PCB, 5G PCB, IC substrate, CCL, smart card, copper coin & heat-sink and other industries.