We need to choose high-tech materials for product development, and the adhesive should use a low coating release film. The medium coating release film is more suitable for using oil glue and protective film, while the high coating release film is not suitable for using protective film.

In terms of material performance, industrial materials must be adhered to so that they can be easily separated; Fluoride release membranes usually do not undergo chemical reactions with the resin system or contaminate the resin system; The elongation of the stretched release film is necessary. It can be consistent with the fibers to prevent deformation and distortion of the prepreg during the preparation process due to asynchronous stretching.

Production Procedure: The key is whether to press or cut. When stamping and cutting, the thickness of the fluorine release film is required to be moderate. When using low weight release film for stamping, it is not easy to break and has poor brittleness. During the stamping and cutting process, the backing paper is prone to tearing the paper and product.

Choose a substrate with sufficient waterproofing to effectively prevent moisture from entering industrial materials through it. When the environmental humidity changes, the length and width of the release film must be constant to avoid wrinkling of the prepreg caused by wrinkling of the release film.

During the production process, to achieve good results, multiple steps are required to cooperate with each other, and care must be taken when selecting high-quality substrates. A good anti-static silicone film is not afraid of complex processes. As long as the quality of the product is good, manufacturers will start from scratch to achieve good anti-static performance and maximize the performance of the product.

Reechas Technology is a national high-tech enterprise that integrates research and development, production, and sales. Since its establishment in 2006, the company has relied on advanced research and production advantages to provide various types of release film hot pressing materials, functional film hot pressing materials, compression buffer materials, circuit board auxiliary materials, etc. for various fields such as hard PCB, soft FPC, soft hard combination boards, 5G circuit boards, packaging substrates, CCL, new energy, smart cards, etc.