High temperature release films are widely used in high-precision industries such as electronic manufacturing, semiconductor packaging, lithium battery production, and optical device manufacturing. Different application scenarios have different requirements for the substrate type, temperature resistance, surface treatment, etc. of high-temperature release films. Therefore, it is crucial to choose a suitable high-temperature release film reasonably.

The substrate determines the key properties of high-temperature release film, such as temperature resistance, mechanical strength, and chemical corrosion resistance. At present, common high-temperature release film substrates include PET (polyester), PI (polyimide), PTFE (polytetrafluoroethylene), PPS (polyphenylene sulfide), etc. Each material has different characteristics and is suitable for different industry needs.

1. PET (polyester) substrate, temperature range: 100-200 ° C, advantages: high cost-effectiveness, high mechanical strength, easy processing; Applicable scenarios: FPC manufacturing, optical film production, electronic tape die-cutting, etc; Limitations: It is prone to deformation and brittleness in high temperature environments above 250 ° C.

2. PI (polyimide) substrate, temperature range: 250-400 ° C, advantages: ultra-high temperature resistance, chemical corrosion resistance, mechanical stress resistance; Applicable scenarios: semiconductor packaging, IC packaging and testing, high-temperature tape manufacturing; Limitations: High cost and difficulty in processing.

3. PTFE (polytetrafluoroethylene) substrate, temperature range: 260-300 ° C, advantages: low surface energy, high chemical resistance, excellent non stick performance; Applicable scenarios: OLED display manufacturing, optical component production; Limitations: High processing difficulty and high cost.

4. PPS (polyphenylene sulfide) substrate, temperature range: 200-250 ° C, advantages: high heat resistance, high mechanical strength, solvent resistance; Applicable scenarios: lithium battery electrode protection, automotive electronics manufacturing; Limitations: Low toughness, not suitable for extreme bending applications.

When choosing a high-temperature release film, it is necessary to select the appropriate temperature resistance level according to the process requirements. The typical temperature resistance requirements for different processes are as follows:

Application          Heat-resistant     Substrate

FPC manufacturing         150-200 ° C      PET

OLED/LCD display         200-250 ° C      PI/PTFE

Semiconductor packaging      250-400 ° C      PI

Lithium battery          180-250 ° C      PPS/PI

Precision die-cutting         100-180 ° C      PET

How to test the temperature resistance performance?

TGA thermogravimetric analysis: testing the quality changes of membrane materials under high temperature environment; Dynamic testing of peel force: testing the stability of peel force under different temperature conditions; Weather resistance test: Test the physical changes of release film in long-term high temperature environment, such as embrittlement, discoloration, etc.