High temperature release films are widely used in high-precision industries such as electronic manufacturing, semiconductor packaging, lithium battery production, and optical device manufacturing. Different application scenarios have different requirements for the peeling force, substrate type, temperature resistance, surface treatment, etc. of high-temperature release films. Therefore, it is crucial to choose a suitable high-temperature release film reasonably.

Peel strength is one of the core indicators for selecting high-temperature release films, usually divided into three types: light release, medium release, and heavy release. The choice of peeling force affects the stability of processes such as die-cutting, lamination, pressing, and protection. Excessive or insufficient peeling force can affect the quality of the final product.

1. Classification of peel strength levels

Low Release: The peeling force is usually between 1-5g/25mm, suitable for processes that require extremely low adhesion, such as optical films, OCA optical adhesives, PET protective films, etc.

Medium Release: The peeling force range is 5-20g/25mm, suitable for applications such as electronic packaging, precision die-cutting, and FPC (flexible circuit board) manufacturing.

High Release: With a peel force greater than 20g/25mm, it is suitable for peeling high viscosity materials such as tape manufacturing, pressure-sensitive adhesive coating, and lithium battery electrode protection.

2. Factors affecting the stability of peeling force

Peel coating materials: The molecular structure of silicon-based, fluorine based, and non silicon-based peel coatings affects the stability of peel force;

Uniformity of coating thickness: Uneven peeling layer may lead to excessive or insufficient local adhesion force;

Environmental factors: Changes in temperature and humidity can affect the performance of the peeling coating, especially in high-temperature environments where products with large fluctuations in peeling force are prone to production defects.

3. Precautions for selecting peel strength

Peel stability test: Conduct dynamic peel testing at high temperatures (150-250 ° C) to ensure that the peel force does not cause adhesion or uneven peeling due to high temperatures;

Matching materials: Different materials (such as optical adhesive, FPC, lithium battery pole pieces) have different requirements for peel strength, and suitable release films need to be selected according to the application.