Attentions Need to Paid During the Production of PET Release Films
1. Arrange to choose a type PET release film Before, what preparations are required
Suggest friends to use pet release film, when making samples, be sure to tube the material, and place the stamped finished product in a temperature controlled environment for 48 to three days to observe the change. If it is not easy to glue marks and easily detach, then most of them can choose this type.
2. Release film can be selected in a dust-free workshop
PET release film can be applied to dust-free workshops, but it is important to pay attention to several types of conditions: production businesses must pay attention to the cleaning work of the surrounding natural environment during segmentation and cutting; During the packaging and transportation stages, it is important to pay attention to external environmental pollution.
3. How can the release film absorb the protective film
Release film manufacturers generally provide unique solutions for the release surface to facilitate the production and processing of various protective films. If the release degree of the release film is not heavy enough, it is necessary to increase the release degree, so that the release film can absorb the protective film.
4. Why are all light release release films not suitable for the adhesion of all medium to high adhesive tapes
Light release generally ranges from 5g to 10g. However, due to the different materials of foam Double-sided tape, the bonding of some foam Double-sided tape requires the bonding of ultra light release film, so one pet release film is unlikely to be suitable for the bonding of all adhesive tapes.
Ruichangxing Technology is a national high-tech enterprise that integrates research and development, production, and sales. Since its establishment in 2006, the company has relied on advanced research and production advantages to provide various types of release film materials, functional film hot pressing materials, compression buffer materials, circuit board auxiliary materials, etc. for various fields such as hard PCB, soft FPC, soft hard combination boards, 5G circuit boards, packaging substrates, CCL, new energy, smart cards, etc.
