Overview:
Adhesive blocking release film is a high-performance and high-temperature resistant resin barrier release film. The barrier release film is used in the circuit board pressing process. After special process design, it can be used to block the multiple lamination processes of buried holes and blind through-holes after resin overflow, with good adhesive blocking and plugging effects.

Advantages of pressing process
1.  Reduce resin pollution
During the pressing process of the circuit board, the adhesive release film ensures that the resin is filled into the inner part of the through-hole without being squeezed out, eliminating the need for secondary treatment due to resin extrusion, improving quality and efficiency.
2. Good hole filling performance
3. With resin extrusion function
Similar to other release films in our company, the adhesive resistant release film also has resin extrusion function, providing excellent copper foil surface buffering effect for damaged steel plates.
4. Balanced distribution of laminated pressure
If we use our high-temperature press pad in the adhesive stripping film system at the same time, it can ensure complete filling of the holes and controlled dielectric thickness. High temperature press pad can eliminate air holes, interlayer slip, and white corners and edges, as well as reduce the transfer of patterns and glass fibers to the board surface, and reduce the possibility of film blistering under low pressure.

◆ Functional characteristics
※  The design of the adhesive blocking release film is used for resin flow control (flowing into adjacent copper layers) in blind through-holes, and can be filled Buried through hole
※  Excellent performance of adhesive release film, suitable for general hydraulic and vacuum assisted hydraulic systems
※  When laminating within the temperature limit of the release film, the adhesive blocking release film is effective for all resins
※  Over the years, this product has been widely recognized
※  Multiple design levels can meet the requirements of multi-level pressing processes
※  Multiple specifications of high-temperature pressing pads are available for selection, while meeting different multi-layer board process requirements
※  Operating temperature can reach 220 ° C
※  The product is inert, does not release gas, has no residue, and has no impact on the board surface, and has no vacuum system pollution
※  Environmentally friendly, environmentally friendly, free of chromium chemicals and halogens