RF660AL | Aluminum Release Film
Thickness: 23 μm
Temperature: 250oC
Color: Silver
Application: Lamination of copper-coin-in board, PCB, 5G communication board
Overview
Aluminum Release Film
RF660AL is a customized aluminum release material with excellent performance under high temperature up to 250 oC. It has stable releasing quality and easy peeling off from the product surface. It is suitable for the application of copper-coin-in lamination.
Features
- 01Environmental protection, no pollution
- 02Good peeling off performance
- 03Smooth surface finish, uniform thickness
- 04High temperature resistant
- 05Replacement for copper coin lamination, promote product quality and reduce cost
