The working principle of high-temperature buffer pads mainly depends on the characteristics of their materials and structural design. Generally speaking, these pads are made of high temperature resistant materials, such as silica gel, heat resistant foam and ceramics. These materials can withstand temperatures up to several hundred degrees without deformation or degradation. When the high-temperature buffer pad is subjected to external impact, its internal molecules will undergo displacement, thereby absorbing the impact force and reducing damage to the underlying equipment by dispersing and delaying the impact energy. In addition, these materials also have excellent thermal insulation properties, which can effectively prevent the conduction of heat and protect equipment from overheating.

High temperature buffer pads are widely used in multiple industries, including the automotive industry, aerospace, electronic equipment, and chemical industry.

In the automotive industry, high-temperature buffer pads are commonly used in areas such as engine hoods, exhaust systems, and brake components. During engine operation, the high temperature generated can cause damage to surrounding components, and high-temperature buffers can effectively isolate heat sources and prevent other components from overheating. In addition, the pads can also absorb vibrations from the road surface, reducing the impact on the body and chassis, thereby improving the driving stability and comfort of the car.

The application of high-temperature cushioning pads is crucial in the aerospace industry. During flight, airplanes experience extreme temperature changes and severe vibrations. High temperature buffer pads are used in aircraft engines, electronic devices, and fuselage structures to provide additional protection. The pads layers can not only withstand high temperatures, but also protect critical components in the event of impact, ensuring the reliability of the equipment. In addition, during the launch and return of spacecraft, high-temperature buffers can effectively isolate heat from the external environment and protect the normal operation of internal instruments.

The miniaturization and high performance of electronic devices have led to an increasing application of high-temperature buffering pads in this field. In electronic products, especially high-power electronic components such as processors and power modules, a large amount of heat is often generated. High temperature buffer pads can effectively isolate heat sources and protect other components from damage. Meanwhile, these buffers can also absorb vibrations generated by the operation of electronic components, enhancing the overall stability and reliability of the equipment. In the fields of data centers and high-performance computing, the application of high-temperature buffering pads helps improve the heat dissipation efficiency of equipment and extend its service life.

With the advancement of technology and the increasing demand for high-temperature applications, the materials and technology of high-temperature buffer pads are also constantly developing. The emergence of new materials, such as carbon fiber composites and nano-materials, provides higher temperature resistance and shock absorption performance for high-temperature cushioning pads. Meanwhile, the trend towards environmental protection and sustainable development has also prompted manufacturers to explore the application of renewable materials. The product upgrade and iteration of high-temperature buffer pads will further expand their application fields, not only limited to traditional industries, but may also enter emerging markets such as renewable energy and electric vehicles. High temperature buffer pads will become a key component in improving equipment safety and reliability.