What is the Maximum Temperature That Release Film Can Withstand?
High temperature resistant release film has a high-temperature resistance of around 180 degrees, and the product has excellent characteristics such as strong resistance to burning and not easy to damage. Therefore, it is widely used in various fields.
High temperature resistant release film features:
1. It has excellent physical and chemical properties, as well as dimensional stability, transparency, and recyclability. Cold resistance (-70 degrees), heat resistance (+200 degrees), and excellent characteristics of corrosion resistance and stable shrinkage.
2. High temperature resistant release film is a packaging film with comprehensive performance. It has good transparency and luster; Has good airtightness and fragrance retention; Moderate moisture resistance, with a decrease in moisture permeability at low temperatures. The mechanical properties of PET film are excellent, and its strength and toughness are better among all thermoplastic plastics. The tensile strength and impact strength are much higher than those of ordinary films; And it has good stiffness and stable size, suitable for secondary 28 processing such as printing and paper bags.
3. Has excellent chemical and oil resistance. However, it is not resistant to strong alkalis and is prone to static electricity. There is no appropriate anti-static method yet, so attention should be paid when packaging powdered items.
High temperature resistant release filmMainly used on glass and plastic surfaces for anti-static and protective purposes.
Reechas Technology is a national high-tech enterprise that integrates research and development, production, and sales. Company selfSince its establishment in 2006, relying on advanced research and production advantages, we have provided various fields such as hard PCB, soft FPC, soft hard combination board, 5G circuit board, packaging substrate, CCL, new energy, smart card, etcRelease membraneMaterials, functional thin film hot pressing materials, compression buffering materials, circuit board auxiliary materials, etc.
