The material of hot lamination release film is PET compound, although it contains silicon, the content is extremely low, and a special surface treatment method is used to make the product pollution-free (silicon removal, silicon transfer) to the circuit board, so it can be comparable to a silicon free release film.

Hot lamination release film products have high tensile strength and tear resistance, chemical inertness, thermal stability, and non stick properties. The surface of the film is flat and smooth, without wrinkles, tears, particles, bubbles, and foreign impurities. It has excellent physical and mechanical properties, small thickness tolerance, high temperature resistance, stable size during pressing, and moderate price, as well as the safety feature of not supporting combustion. Therefore, it has become an excellent thin film material in the production process of multi-layer boards, and is an ideal isolation material for hard boards (PCBs), soft circuit boards (FPCs), and CCL laminations (pressure transfer, fast pressing).

The hot press release film is an innovative product in the field of BOPP. Its temperature resistance can generally reach 135 ℃, and it also has heat resistance without hydrolysis. It also has the inherent properties of bopp film, such as maintaining high transparency, good transfer performance, and printability. The hot press release film has heat resistance (temperature resistance of 135 ℃); Excellent transparency; Good flatness and high glossiness; Minimal film surface defects; Good printing and transfer effects.

The hot press release film can be used for transferring printing patterns on the textile industry (clothing, leather, etc.), changing the appearance of leather and adding some of its functions (rich in color, delicate, dazzling, long-lasting, wear-resistant, and high-temperature resistant). The hot press release film has excellent market competitiveness due to its temperature resistance and high clarity, and has been supported and welcomed by customers in the leather industry.

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