Silicone gasket can be applied in different scenarios, and different scenarios require silicone gaskets to play different roles. At this point, we need to choose the appropriate silicone gasket according to the requirements of different scenarios. Let's learn about the classification of silicone gaskets and the applicable scenarios together.

1. Thermal conductive silicone pad

Thermal conductive silica gel sheet is a kind of thermal conductive medium material synthesized by special process with silica gel as the base material, adding various auxiliary materials such as metal oxides. In the industry, it is also called thermal conductive silica gel pad, thermal conductive silica gel film, soft Thermally conductive pad, thermal conductive silica gel pad, etc.

It is used for control main boards of electronic and electrical products, pads and footpads inside and outside motors, electronic and electrical appliances, automobile machinery, computer hosts, laptops, DVDs, VCDs and any materials that need to be filled and Heat spreader.

2. Silicone insulation pad

The silicone pad is made of 100% silicone raw materials for heat insulation, which has good thermal insulation, environmental protection, health, safety and easy cleaning, and can withstand high temperature up to 230 degrees. The silicone pad can better fix items and effectively prevent items from sliding. It is generally suitable for various entertainment and leisure places such as ovens, refrigerators, microwaves, disinfection cabinets, dishwashers, washing machines, restaurants, hotels, coffee shops, and can also be used for home kitchens.

3、Silicone gasket

      Silicone gaskets have a wide range of applications and can be applied in many scenarios. Generally used on industrial machinery, as a buffer and fastener for machine operation, it can play a role in anti-skid, shockproof, anti-static, and high-temperature resistance, better protecting the machine and reducing losses. Ruichangxing Technology is a national high-tech enterprise that integrates research and development, production, and sales. Since its establishment in 2006, the company has relied on advanced research and production advantages to provide various types of release film hot pressing materials, functional film hot pressing materials, compression buffer materials, circuit board auxiliary materials, etc. for various fields such as hard PCB, soft FPC, soft hard combination boards, 5G circuit boards, packaging substrates, CCL, new energy, smart cards, etc.