Fluorine element release film  is made of fluorinated organic silicon coated on the surface and has the characteristic of high temperature resistance. Regarding silicone tape, it has excellent peeling function. Fluorine release film is primarily used in high-temperature tape and gold finger composite die-cutting processes.

Usage and characteristics of anti-static release film:

In the era of information technology, electromagnetic waves can cause varying degrees of disturbance to unshielded sensitive electronic components, circuit boards, communication equipment, etc., resulting in data distortion and communication disorder. The static electricity caused by electromagnetic induction and conflicts can cause destructive effects on various sensitive components, instruments, certain chemical products, etc. If high-voltage discharge occurs due to the accumulation of static electricity in packaging films, the results will be destructive, so anti-static films are also important.

The use of anti-static film is also mainly in dry tape, double-sided tape, fine material die-cutting and other professions.

Application and characteristics of non silicon release film:

In addition to having a heavy peeling force, non silicon thin films can also function in certain fields that cannot contain silicon because they do not use silicon series release agents. Non silicon thin films have characteristics such as uniform and stable release force, uniform thickness, strong temperature and weather resistance, good tensile strength, and good thermal stability.

The primary uses of non silicon release films are Hot-melt adhesive, HC transfer printing, micro adhesive and micro adhesive protective film processing films. In addition, due to its heavy peeling force, it can effectively prevent the film from moving or falling when processing very fine components.

Reechas Technology is a national high-tech enterprise that integrates research and development, production, and sales. Since its establishment in 2006, the company has relied on advanced research and production advantages to provide various types of release film materials, functional film hot pressing materials, compression buffer materials, circuit board auxiliary materials, etc. for various fields such as hard PCB, soft FPC, soft hard combination boards, 5G circuit boards, packaging substrates, CCL, new energy, smart cards, etc.