Six major functions of Anti static ionization film: Release film is increasingly used in electronic products, especially with the rapid development of FPC soft boards. Previously, non anti-static release films were used, and the process did not meet the requirements. However, for electronic products, anti-static protection is very important. Therefore, ordinary release films can no longer meet the production and use of electronic products. Perhaps this is the survival of the fittest in technological development, If we cannot meet customer needs, there will gradually be no market. As long as there is customer demand, there will be a market. Ruichangxing anti static ionization film will develop into a trend in the future.

1. Adhesive release PET can be classified into light peel, medium peel, and heavy peel based on the mobility of silicon and the changes in peel force after heating. This can be controlled according to customer requirements and has good heat resistance.

2. It has high stability under extreme weather conditions, with a high temperature resistance of around 130 ℃ over a long period of time and around 180 ℃ within one hour;

3. The anti-static release film has no migration phenomenon, eliminating the danger of silicone resin release film transferring to the material it is tightly attached to;

4. The tolerance for weight per unit area of single or double sided coating of release film is very small;

5. The base film has excellent mechanical strength and chemical properties;

6. Having a longer shelf life;

Okay, that's all for the six major functions of anti static ionization film. If you are not familiar with the six major functions of the release film manufacturer, you can click on the online customer service on the website of Reechas. Reechas is a high-tech enterprise founded in 2006 and headquartered in Shenzhen, China. We focus on the development, production, and sales of integrated laminating products, including release films, conformal films, and press pads. These products are widely usedin PCB, FPC,  rigid-flex PCB, 5G PCB, IC substrate, CCL, smart card, copper coin & heat-sink and other industries.