Buffer pads are essential auxiliary materials in high-precision industrial manufacturing processes such as PCB manufacturing, semiconductor packaging, and display panel production. It plays an important role in the lamination process, such as buffering pressure, uniform heat conduction, and reducing stress concentration. However, many companies have shortened the service life, decreased performance, and even affected product quality of buffer pads due to improper use or improper maintenance during the production process.

The correct usage method of buffer pad

1. Choose the appropriate buffer pad

Different production processes require different types of buffer pads, therefore, before use, it is necessary to correctly select the type of buffer pad suitable for specific PCB manufacturing, IC packaging, or display panel production.

When choosing a buffer, the following factors should be noted:

High temperature resistance: Ensure that the buffer can adapt to the temperature of the laminating process (180 ° C~280 ° C).

 Thermal conductivity: Choose a buffer pad with good thermal uniformity to optimize resin curing.

Pressure resistance: The buffer pad needs to have sufficient elasticity to prevent stress concentration during the lamination process.

2 Correct steps for laminating use

To ensure optimal performance of the buffer pad during the lamination process, the following steps should be followed:

Clean the interior and workbench of the laminating machine to avoid dust or impurities affecting the contact surface of the buffer pad. Reasonably place the buffer pads to ensure that they are flat and wrinkle free, and avoid excessive stretching. Adjust the laminating pressure and set the appropriate pressure according to the type of buffer pad to avoid material damage caused by excessive compression. Control the temperature curve, and match the temperature resistance range of the buffer pad with the laminating process to avoid affecting the buffering performance due to high or low temperature. Slowly cool down after lamination to prevent deformation or damage to the buffer due to excessive temperature difference.

Daily maintenance techniques for buffer pads

1 Cleaning and maintenance to avoid contamination

Before and after each use, check the surface of the buffer pad for resin residue, dust, or foreign objects. If necessary, wipe it with a dust-free cloth to keep it clean. Regularly use mild cleaning agents to wipe the buffer, avoiding the use of corrosive solvents to prevent degradation of the buffer material.

2 Storage Environment Requirements

Buffer pads should be stored in a dry, cool, and dust-free environment, avoiding moisture or exposure to high temperatures to prevent aging. Avoid stacking under heavy pressure, as prolonged stacking may cause the buffer to lose its elasticity.

3 Prevention of physical damage to buffer pads

Avoid scratching the buffer with sharp objects, such as metal tools or PCB burrs. When installing and removing the buffer pad in the laminating machine, pay attention to the strength to prevent bending or tearing of the buffer pad.