VIPADS | Functional Press Pads
Thickness: 0.7/0.9/1.2mm, customizable
Temperature: 230°C
Color: White
Application: Lamination of PCB, Rigid-Flex board, FPC, High count layer, Multi-layer board, metal substrates, and thick copper coin or Heat sink boards.
Overview
High Compression Ratio
VIPADS is a press pad made of paper fiber designed for the lamination process of PCBs, rigid-flexible boards, FPCs, high count layers, multi-layer boards, metal substrates, and thick copper coin or heat sink boards. In the lamination process, VIPADS can accurately control the heat transfer and pressure on the surface of the circuit board, thereby achieving pressure balance and buffering. It is a buffer material with excellent performance.
Features
- 01Better performance compared to competitor
- 02Recognized by listed companies
- 03Self-developed
- 04Smooth surface finish, uniformed thickness
- 05Temperature: 230°C
- 06Accurate heat-rise control
- 07Low fiber & dust
- 08Pressure equalization
- 09Sulfur-free, odorless, solvent-free
- 10No out-gassing of contaminants harmful to Vacuum Systems
- 11Suitable for incineration or land-fill disposal
- 12Width and length can be customized
- 13Pin-hole process service available, save cost for customers
