In industries such as electronic die-cutting, labels, protective films, PCBs, and optical materials, release film is an indispensable functional material. The "peel force," as one of the most critical performance indicators of release film, directly determines whether it can efficiently match adhesive materials, whether it can peel smoothly, and whether it will cause adhesive residue or product defects. Choosing the wrong peel force not only affects yield rates but also leads to process rework and cost wastage.

1. What is peel force? The "invisible performance parameter" of release film

Release Force refers to the force required to peel off adhesive materials (such as glue, double-sided tape, or optical adhesive) from the surface of a release film, commonly measured in g/inch (grams per inch). It reflects the interaction strength between the surface coating (e.g., silicone oil or fluorine) of the release film and the adhesive material.

From a functional perspective, the release force must be "just right": too light ➝ the adhesive material may detach during lamination or transportation; too heavy ➝ difficult peeling, stringing, material breakage, or even residual adhesive affecting product performance. Therefore, accurately selecting the release force level is a crucial step in the successful application of release films.

In the industry, the peel force is typically classified into three grades:

①Light Peel Release Film: Used for materials with low adhesion, such as mobile phone screen protectors, anti-scratch PET adhesive films, and heat-sealed labels. These products require smooth peeling to prevent residue and material deformation.

②Middle peel-type release film: Widely used in the electronic die-cutting industry, it is the most common type. It balances load-bearing and peel-ability, making it suitable for various thick and thin double-sided tapes, EVA foam adhesive tapes, FPC films, and more.

③Heavy Peeling Release Film: Suitable for high-viscosity products such as OCA optical adhesives, pressure-sensitive adhesives, or structural bonding materials. It requires higher peeling force to maintain stability during processing and prevent premature detachment of the adhesive layer.

The key to correctly selecting the peeling force lies in understanding the adhesive characteristics of the adhesive material and the actual process requirements. Here are practical selection logic suggestions:

1. Check the type of glue

Hot melt adhesive and water-based adhesive are mostly low viscosity, and it is recommended to use a light peel type; Acrylic adhesive, silicone adhesive, medium adhesive, recommended medium peel type; Optical adhesive (OCA) and structural adhesive are highly adhesive, and it is recommended to re peel them.

2. Check the usage stage

The use of intermediate carriers (such as die-cutting carriers) places more emphasis on clean peeling and anti residue adhesive, and it is recommended to use intermediate peeling type; The final protective purpose (such as factory protection of film) needs to be easily peeled off, choose a light peel type; Hot press composite application: The activity of the adhesive material is improved, and the peeling force is appropriately increased to prevent displacement.

3. Check the processing method

The process of automatic die-cutting and fast bonding requires stable peeling force and minimal fluctuations; Multi layer composite or high-speed waste disposal ➝ Medium high peeling is more conducive to maintaining structural integrity. In summary, different levels of peel strength should be considered in conjunction with the properties of the adhesive material, die-cutting process, bonding environment, and final use, to avoid a one size fits all approach.