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High Temperature Resistant Matte Release Film for PFC Lamination

Matte release film is the preferred isolation material for epoxy resin printed circuit processing, with high tensile strength and tear strength. The professional manufacturer of release film will explain to you the characteristics and characteristics of FPC copper clad plate and aluminum substrate laminated high-temperature resistant matte release film.

Matte release film is the preferred isolation material for epoxy resin printed circuit processing, with high tensile strength and tear strength. The professional manufacturer of release film will explain to you the characteristics and characteristics of FPC copper clad plate and aluminum substrate laminated high-temperature resistant matte release film.


There are many types of matte release film, including high gloss film, reflective film, coating film, anti-static film, etc. It can be used on various printed circuit boards such as aluminum substrates, copper clad boards, flexible circuit boards, etc. It has the effects of protection, release, adhesive resistance, filling, etc. It is an essential process in the circuit board pressing process. Below, we will introduce a Ruichangxing high-temperature resistant PET matte release film.


Overview:;

Thickness: 20-150 UM

Width: 0-1500 MM

Length: Any

Temperature resistance: around 200 ℃


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The high-temperature resistant film for circuit boards is a type of high-temperature release film that can be used for the production of rigid and flexible circuit boards. This release film adopts patented process technology, with strict quality control, and undergoes post curing. It has the characteristics of high temperature resistance, good release effect, and pollution-free pressing process.

Release film can be supplied in rolls and customized sizes to meet different customer specifications.


Advantages of pressing process

High temperature resistance Matte release film provides the moderate and externally applied hydraulic pressure required to drive the laminated components to achieve dense lamination, which can eliminate air from entering the bottom of the protective layer and between the circuit boards.


◆  Performance characteristics

Used for rigid, flexible circuit boards, HDI boards, FPC boards Separation profiles for soft and hard bonding boards, etc

Color: milky white, matte, transparent, etc

The release surface has double-sided or single-sided release film, which is environmentally friendly and pollution-free

High temperature resistance 200 ± 5 ° C

The surface is smooth and smooth, with excellent molding performance, easy to peel off, and easy to operate

Thickness: 25UM, 27UM, 30UM, 32UM, 36UM, 50UM, etc

The RCX-RF release film does not release gas, does not have board chips, interlayer bonding, vacuum system pollution, and does not affect the surface quality of the circuit board

Environmentally friendly: free of ozone depleting substances, halogen-free elements, and in compliance with the latest EU ROHS requirements