The uniform transmission of the working pressure and temperature of the hot pressed board can make the adhesion between the paper veneer and the substrate more tight, uniform, and flat, thereby improving the surface and internal quality of the decorative board.  The silicone pads has excellent performance such as buffering and heat resistance, compensating for printing plate errors, and protecting templates.

When laying, the cushion surface must be installed from top to bottom between the heat transfer plate of the hot press and the stainless steel template. The cushion must be flat. The seeds are not fixed to prevent debris from entering the sidewalk. Then heat up to 60-80 degrees Celsius and increase the pressure to slightly close the pressure plate. During the fixation process, only the four corners in the length direction are fixed, and the width direction is not fixed. After applying over 200 to 300 pieces of heat, the seat cushion slightly contracts, and it needs to be stopped before readjusting the tension of the seat cushion.

When the cushion is newly used, there is a process of applying it. The buffer pad is placed on the upper press and transferred to the lower press after a period of use, which can ensure a good effect on the pressing surface and extend its service life. According to feedback from the flooring company, this is not a quality issue or replacement of the cushion, but rather improper use. Due to the production of many colored floors, a buffer pad often uses multiple templates continuously, resulting in a tortuous change in the template of the buffer pad and affecting its service life. Moreover, some manufacturers have started implementing stainless steel templates with buffer pads to ensure that the buffer pads are hygienic while the steel plates are being used. Avoid continuous operation of steel pads at high temperatures of 180-220 degrees Celsius, naturally shortening their lifespan.

Ruichangxing Technology is a national high-tech enterprise that integrates research and development, production, and sales. Since its establishment in 2006, the company has relied on advanced research and production advantages to provide various types of release film materials, functional film hot pressing materials, compression buffer materials, circuit board auxiliary materials, etc. for various fields such as hard PCB, soft FPC, soft hard combination boards, 5G circuit boards, packaging substrates, CCL, new energy, smart cards, etc.