There are many specialized terms in PCB circuit boards, and it is also necessary to know these terms. Here, we will explain some professional terms in PCB circuit boards.

1. Autoclave Pressure cooking
It is a container full of high temperature saturated water vapor and can also apply High-pressure area. Laminates can be placed for a period of time to force water vapor into the plate, then take out the plate sample and place it on the high temperature molten tin surface to measure it; Resistance to layering" The characteristics of. This word is also synonymous with Pressure Cook and is commonly used in the industry. In addition, there is a method of using high-temperature and high-pressure carbon dioxide in the multi-layer plate pressing process; Tank pressure method;, It also belongs to this category of Autoclave Press.

2. Cap Lamination
It refers to the traditional lamination method of early multi layer boards, which was then MLB's" Outer layer; Multiple single sided copper sheet thin substrates were used for lamination and lamination, and it was not until the end of 1984 when MLB production increased significantly that the current copper sheet type large or large scale lamination method (Mss Lam) was used. This early MLB pressing method using a single sided copper sheet thin substrate is called Cap Lamination.

3. Caul Plate partition
When multi-layer boards are pressed together, many are often stacked between each opening of the press bed; Book" The loose materials to be pressed on the board (such as 8-10 sets), with each set" Loose materials" (Books) must be separated by flat, smooth, and hard stainless steel plates. The mirror stainless steel plates used for this separation are called Caul Plate or Separate Plate, and currently commonly used ones include AISI 430 or AISI 630.

4. Crease wrinkles
In multi-layer board pressing, it often refers to the wrinkles that occur during improper processing of the copper sheet. Thin copper sheets below 0.5 oz are more prone to this disadvantage when laminated in multiple layers.

5. Dent Depression
Refers to the gentle and uniform subsidence on the copper surface, which may be caused by the local protruding points of the steel plate used for pressing. If there is a neat drop in the fault like edge, it is called Dish Down. If these drawbacks unfortunately remain on the line after copper corrosion, it will cause the impedance of high-speed transmission signals to be unstable, resulting in noise noise. Therefore, such defects should be avoided as much as possible on the copper surface of the substrate.

Reechas is a high-tech enterprise founded in 2006 and headquartered in Shenzhen, China. We focus on the development, production, and sales of integrated laminating products, including release films, conformal films, and press pads. These products are widely usedin PCB, FPC,  rigid-flex PCB, 5G PCB, IC substrate, CCL, smart card, copper coin & heat-sink and other industries.