The REE100AP is composed of a multi-layer composite structure with uniform thickness, high temperature resistance, good conformal effect, strong control ability of plate surface expansion and contraction, and it also possesses certain anti-wrinkle and leveling abilities, as well as an appropriate resin resistance effect. It is widely used in the lamination of circuit boards with high lamination temperatures. It has good conformal effect and adhesive flow control performance, with flat surface and stable expansion & contraction. It is a film with excellent performance.