REE50S | TPX Release Film
Thickness: 50 μm
Temperature: 190oC(up to 3mins) or 170oC(up to 1 hour)
Color: White, translucent
Application: Lamination of FPC
Overview
FPC Quick Press
REE50S is engineered as a high-performance release film for various applications. With its excellent release and heat resistance, it is used as a circuit board and cutting-edge material based on flexible printed circuit board ( FPC ). It has good resin flow control performance, excellent flexibility, and an ultra-smooth surface finish. In addition, it has no contamination in the vacuum system and leaves no residue on the separator plate.
Features
- 01Adhesive flow control
- 02No silicone oil residue
- 03Excellent flexibility
- 04Ultra smooth surface finish
- 05Good conformal effect
- 06No residue on separator plate, no contamination to vacuum system
Performance Data
| Property | Direction | Unit | Standard Value | Test Value | Test Method |
| Thickness | / | μm | 50 ± 10 | 50 | GB/T 6772-2001 |
| Tensile | MD | MPa | ≥ 20 | 34 | GB/T 1040-2006 |
| TD | 28 | ||||
| Elongation | MD | % | ≥ 10 | 325 | |
| TD | 35 | ||||
| Shrinkage rate | MD | % | -2 ≤α ≤2 | -0.4 | Solartron Method(170℃,30min) |
| TD | 0.6 |
