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Requirements and Testing Methods for Release Film in PCB Lamination

Release membrane, also known as stripping membrane, isolation membrane, separation membrane, etc. Generally speaking, in order to increase the release force of plastic films, they will be treated with plasma,

Release film also known as peel off film, isolation film, separation film, etc. Generally speaking, in order to increase the release force of plastic films, they will be treated with plasma, fluoride, or silicon(Silicone release agents are applied to the surface of thin film materials, such as PET, PE, OPP, etc; It has a very light and stable release force on various organic pressure sensing adhesives (such as Hot-melt adhesive, acrylic adhesive and rubber pressure sensing adhesive). Depending on the required release force, the viscosity of the isolation product adhesive varies, and the release force is adjusted accordingly to achieve a very light and stable release force during the stripping process.

Release film application

The application of release films is very extensive. Now let's introduce its application of in PCB industry.The emergence of PCB circuit boards has a history of over 100 years. It has the characteristics of high temperature resistance, good release effect, and pollution-free compression process. And gradually, more and morePopularization of PCB circuit board factories.

For PCB release film, with high temperature resistance, is suitable for the production of rigid and flexible circuit boards. It adopts special processes and technical treatment, undergoes strict quality control and final solidification treatment, and has the characteristics of high temperature resistance, good release effect, and pollution-free pressing process. Can be customized according to different customer needs to meet different specification requirements.

During the lamination process of FPC,Its quality also affects the quality of flexible circuit boards. This article mainly introduces the requirements and testing methods for the release film of flexible circuit boards.

Requirements for flexible circuit boards:

1. The release film is resistant to high temperatures and is not easily deformed.

2. Good flatness

3. The compound effect is good and can be used multiple times.

The detection method used for flexible circuit boards:

Appearance inspection:  its surface should be smooth, without horizontal or vertical lines, particles, bubbles, pinholes, or stains.

     Conduct temperature resistance test (test temperature:230 degrees Celsius; Pre pressing for 10S; Forming time 180S, pressure 100kg/cm2, continuous testing 5-10 times), brittleness is not allowed during the testing process.