REEPLUS  is a functional release film with functions such as covering, filling, release, and buffering, which can replace Pacoplus from the USA . Specially designed for the hot pressing process of soft and hard bonding boards, FPC flexible circuit boards, PCB printed circuit boards, and High- and low-level difference circuit boards. The REEPLUS functional release film provides stable and controllable advantages in the hot pressing process for circuit board lamination.

Advantages of pressing process

1. Effectively solving the problem of "board surface shrinkage"

The REEPLUS functional release film "locks" around the pressed parts, thereby reducing deformation caused by heat and pressure. REEPLUS has a significant effect in the Z-axis direction, with minimal deformation in the X-Y axis direction, effectively solving the problem of board surface shrinkage in the X-Y axis of the circuit board and improving product quality.

2. The filling effect of the board surface covering is good

The REEPLUS functional release film provides the moderate and finely applied hydraulic pressure required to drive the laminated components to reach the protective layer, and eliminates the entry of air between the bottom of the protective layer and the circuit board, ensuring excellent adhesion between the side walls of the circuit board. This allows the entire hot pressing process to truly reflect the appearance of the laminated circuit board.

3. Has a certain adhesive resistance ability

The REEPLUS functional release film can prevent acrylic or epoxy resin adhesive from flowing into drilled or punched holes to a certain extent, and can also play a certain barrier role at the surface joints of soft and hard bonding plates, possessing certain adhesive resistance properties.

4. Quick and convenient peeling characteristics

The REEPLUS conformal release film provides rapid and effective release performance on both sides. To meet customer needs, suitable peel off appearance products can be customized and produced.

5. Balanced Lamination Pressure

The thickness of the REEPLUS comformable release film reaches 300um, and the hot pressing process has a certain buffering performance. If the combination of the REEPLUS functional release film and the paper pressing cushion VIPADS can make the high and low pressure areas of the circuit board have the same pressure, the laminating pressure acts along the Z axis, plays the role of equalizing pressure, reduces the problem of pressure loss on the board surface, and effectively solves the hot pressing problem of products with large High- and low-level difference.

Functional characteristics

1. Replace imported products from the United States

2. Double sided release, easy to peel off

3. Strong covering and filling ability

4. Has certain cushioning and adhesive resistance characteristics

5. Minimal deformation along the X-Y axis, effectively solving the problem of "board surface shrinkage"

6. The surface of the film is flat, smooth, and smooth, with excellent molding characteristics

7. Operating temperature up to 205 ° C (specially designed structure, temperature resistance above 220 ° C)

8. Thickness: 300um, or other specifications can be customized according to requirements and dosage

9. Size specifications: 18.5 * 24.5 ", 20 * 26", etc. Other sizes can be customized

10. Environmentally friendly, free from harmful substances, and will not affect the vacuum system