Fluoroplastic release film used for isolating adhesive materials, widely used in industries such as electronics, spray consumables, reflective materials, tape, self-adhesive waterproof rolls, etc. This article explains the characteristics and properties of fluoroplastic release films for you.

Properties of fluoroplastic release film:

1. No migration phenomenon, eliminating the risk of silicone resin release film transferring to nearby materials.

2. Controllable release force, high glossiness, high cleanliness, residual adhesion of 94%, and good surface performance.

3. Excellent UV aging resistance, chemical corrosion resistance, and solvent penetration resistance.

4. The colors are generally transparent and milky white.

Fluorine plastic release film is mainly used as a carrier for vacuum aluminum plating, which involves placing the PET film into a vacuum aluminum plating machine, gluing it with paper, and then peeling off the PET film. The aluminum molecular layer is transferred to the surface of the cardboard through adhesion, forming the so-called aluminum coated paper.

Characteristics of fluoroplastic release film:

1. It can prevent the adhesion of the prepreg and protect the prepreg from contamination.

2. Release paper can adhere to the prepreg, but it is easy to separate the two and has sufficient density to prevent water from entering the prepreg through the prepreg.

3. Not prone to chemical reactions, resistant to temperature and humidity, moisture-proof, and oil-resistant, providing product isolation.

4. Good high-temperature resistance, smoothness, and strength.

Reechas Technology is a national high-tech enterprise that integrates research and development, production, and sales. Since its establishment in 2006, the company has relied on advanced research and production advantages to provide various types of release film, conformable film materials, press pads, circuit board auxiliary materials, etc. for various fields such as hard PCB, soft FPC, soft hard combination boards, 5G circuit boards, packaging substrates, CCL, new energy, smart cards, etc.