Characteristics and Applications of PET Release Film
Single/Double sided PET release film is widely used in die-cutting and composite adhesive products due to its excellent high-temperature resistance . The product uses PET film as the substrate and is evenly coated with an extremely thin release agent on one or both sides. The surface of the PET release film is flat and smooth, and the coating is uniform, without defects such as wrinkles, particles, bubbles, etc. The product has excellent physical properties, small thickness tolerance, and low heat shrinkage rate. It has high tensile strength, tensile elongation, and chemical inertness.
PET release film is generally used to isolate adhesive materials and is widely used in industries such as electronics, spray painting consumables, reflective materials, tape, self-adhesive waterproof rolls, etc. The adhesive release film can be divided into light release type, medium release type, and heavy release type based on the mobility of silicon and the changes in the release force after heating. It can control the release force according to requirements and has good heat resistance.
Product thickness: 0.019mm, 0.025mm, 0.036mm, 0.05mm, 0.075mm, 0.1mm, 0.125mm, 0.175mm, 0.188mm
Controllable release force, high glossiness, high cleanliness, residual adhesion of 92%, good surface performance.
Release film characteristics when compounded with adhesive products:
1) There is no migration phenomenon, eliminating the danger of silicone release film transferring to the material it adheres to
2) The tolerance of weight per unit area for single or double sided coating of PET release film is very small.
3) The base film has excellent mechanical strength and chemical properties.
4) High temperature resistance can reach 180 ° C over a long period of time and 200 ° C within 10 minutes.
5) High stability under extreme weather conditions.
6) Extremely long shelf life.
Reechas Technology is a national high-tech enterprise that integrates research and development, production, and sales. Since its establishment in 2006, the company has relied on advanced research and production advantages to provide various types of release film materials, functional film hot pressing materials, compression buffer materials, circuit board auxiliary materials, etc. for various fields such as hard PCB, soft FPC, soft hard combination boards, 5G circuit boards, packaging substrates, CCL, new energy, smart cards, etc.