High thermal conductivity aluminum substrate is a high-end thermal conductivity aluminum substrate in the aluminum substrate industry, currently produced and manufactured by 5-10 manufacturers worldwide. Below, we will explain the use of high thermal conductivity aluminum substrates for everyone.

The product project of high thermal conductivity aluminum substrate covers the entire industry of lighting products, such as commercial lighting and indoor lighting. Overall, LED aluminum substrates will continue to maintain rapid development in the coming years, with export amounts steadily increasing but export growth decreasing. Due to the sustained development of the economy, domestic sales have entered a period of rapid growth. However, with the rapid development of China's high thermal conductivity aluminum substrate industry in the past five years, the release film of high thermal conductivity aluminum substrate has also caused fierce competition to this day.

High temperature release film for high thermal conductivity aluminum substrate is a type of high temperature release film that can be used for the production of rigid and flexible circuit boards. This release film adopts patented process technology, with strict quality control, and undergoes post curing. It has the characteristics of high temperature resistance, good release effect, and pollution-free pressing process. Release film can be supplied in rolls and customized sizes to meet different customer specifications.

Features:

1. Color: milky white, matte, transparent, etc

2. The release surface has double-sided or single-sided release film, which is environmentally friendly and pollution-free

3. High temperature resistance 200 ± 5 ° C

4. The surface is smooth and smooth, with excellent molding performance, easy to peel off, and easy to operate

5. Thickness: 25UM, 27UM, 30UM, 32UM, 36UM, 50UM, etc

6. The release film does not release gas, does not have board chips, interlayer bonding, vacuum system pollution, and does not affect the surface quality of the circuit board

7. Release materials for rigid, flexible circuit boards, HDI boards, FPC boards, soft hard bonding boards, etc