In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

In various fields such as industrial production, electronic equipment manufacturing, transportation packaging, etc., laminated cushioning pads play a crucial role as important protective components. They not only effectively absorb shock and evenly distribute pressure, but also provide protective isolation to prevent damage to items during transportation or use. However, there are many types of cushion pads in the market, and how to choose the compression cushion pad that suits your needs has become a challenge for many enterprises in procurement and production. Material is one of the key factors determining the performance of cushioning pads, and different materials have different physical properties, durability, and applicable environments. Common cushion materials include silica gel, rubber, polyurethane, foam and plastic. Each material has its unique advantages and applicable scenarios.

In the process of automobile manufacturing, with the continuous advancement of technology, more and more high-precision components are being applied to various fields of automobiles. Especially in vehicle manufacturing, electronic system assembly, interior processing, and the production of other key components, release film plays a crucial role as an indispensable auxiliary material. Release film not only effectively protects the surface of automotive components from contamination, scratches, or adhesion during processing, transportation, and storage, but also improves assembly accuracy, ensuring production efficiency and product quality.

The release film under high temperature environment must have strong heat resistance and stability. This is because in many production processes, such as composite material molding, electronic component packaging, and automotive parts manufacturing, the process temperature involved may reach up to 200 ° C or higher. Therefore, release films need to maintain the stability of their physical and chemical properties under high temperature conditions to avoid thermal degradation, melting, aging, or deformation at high temperatures.

With the widespread use of multi-layer boards and HDI boards, PCB manufacturers have gradually realized a key auxiliary material that has been neglected for a long time - the cushion pad, in the process of improving the compression yield. Especially when facing complex structures such as high-order blind buried hole plates, thick copper plates, and rigid flex joint plates, pressing problems occur frequently, such as warping, bubbling, copper surface pressure damage, resin accumulation, etc. Then, how to choose the most suitable cushion pad for your product and process?

In the current large-scale application of high-density interconnect (HDI) boards, the lamination process has always been the top priority for quality control. Whether it's smartphone motherboards, car system control boards, or advanced communication base station equipment, HDI technology is irreplaceable in improving integration and signal integrity. However, many manufacturers frequently suffer from issues such as warping, bubbling, blind hole cracking, delamination, and copper surface damage during HDI board lamination. These problems are not uncommon. Where is the problem? Many times, it's not a big problem with the equipment or design, but rather you may have overlooked a key auxiliary material - the compression buffer pad. Today we will delve into why HDI board lamination is prone to problems, and how to effectively improve lamination quality and product yield by selecting suitable cushioning materials.

With the rise of high-end applications such as 5G communication, artificial intelligence, and automotive electronics, PCB boards have increasingly more layers and more complex structures. For multilayer boards like 6-layer, 8-layer, or even 22-layer and beyond, the stability of the lamination process directly determines the performance and yield of the circuit board. Among these, an overlooked material—the lamination buffer pad—plays a crucial role in enhancing lamination quality. Multilayer PCB is made by bonding multiple copper-clad laminates and pre impregnated resin layers (PP) through a lamination process. As the number of layers increases, the thickness of the board increases, the requirements for alignment accuracy improve, and the accumulation of thermal stress increases, resulting in a geometric multiple increase in manufacturing difficulty.

In the high-precision PCB manufacturing process, lamination is one of the core processes that affect the final product quality. However, common issues such as bubbling, warping, delamination, and copper surface damage during lamination often perplex engineers. Beyond stack-up design, equipment parameters, and lamination programs, there is another easily overlooked "hidden contributor" playing a crucial role—namely, the lamination cushion pad. The PCB lamination process is essentially a thermal compression bonding process: multiple layers of materials (such as copper foil, core boards, prepreg, etc.) are bonded under high temperature and pressure to form a complete multi-layer circuit board structure.

In the manufacturing of multi-layer PCBs, the success or failure of the lamination process directly determines the yield and performance stability of the product. In the lamination process, a crucial auxiliary material that is easily overlooked is the compression cushion pad (Cushion Pad/Press Pad), which often determines whether the finished board is "flat, non foaming, and non pressure damaged". This article will systematically explain "how to choose a cushion pad" from five aspects: the principle of cushion pad, material selection, matching strategy, common problems, and selection suggestions. It will help you improve the quality of compression and make your multi-layer board more stable and flat!