In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

In PCB pin lamination, the pin and bushing system is often treated as auxiliary tooling—something that simply locates the panel and keeps the stack aligned. In reality, it is a yield-critical interface. The fit between pin and bushing determines registration repeatability. The surface condition of the pin determines whether resin sticks, builds up, and contaminates the tooling hole. The release behavior after lamination determines whether the panel is demolded cleanly or damaged during extraction. For HDI, high-layer-count, and fine-line boards, these are not minor details. They directly affect layer-to-layer alignment, tooling life, downtime, and scrap rate. That is why our PIN/BUSHING solutions are designed around three core performance requirements: high precision, anti-stick performance, and easy release.

Why pressure uniformity—not just compression—decides microvia reliability, thickness control, and yield in HDI press lamination In HDI PCB lamination, pressure is often treated as a single number: “press at X bar.” But across the panel, pressure is never naturally uniform. Copper density varies. Prepreg thickness changes. Layer count transitions create local stiffness differences. Microvia areas, fine-line regions, and large copper planes all respond differently under the same platen force. The press pad’s job is to turn that non-uniform stack into a uniform pressure field. That is what uniform pressure distribution means—and in HDI, it is not a comfort feature. It is a yield capability.

In PCB lamination, the press pad is often described in passive terms: it cushions, it equalizes, it compensates. But the compression ratio of that pad—how much it deforms under load relative to its original thickness—quietly sets the ceiling for thickness uniformity, resin flow control, and yield on high-layer-count and HDI builds. A higher compression ratio is not simply “softer.” It is a wider process window, and in lamination, process window is everything

When engineers compare release films for PCB lamination, the first numbers they check are usually release force, temperature rating, and thickness. Those matter. But in practice, the single biggest driver of yield in vacuum lamination is a pair of qualities that rarely gets top billing: filling and conformability. The film's ability to soften under heat and pressure, flow into every contour of the panel topography, and transmit pressure evenly in the Z-axis without stretching or distorting in X-Y. It sounds almost passive. In reality, it is what separates a board with clean via fill, no white corners, and crisp line definition from a board that needs rework.

In PCB manufacturing, thickness uniformity is more than a cosmetic requirement. It affects impedance control, lamination stability, assembly reliability, and overall yield. Even small variations in board thickness can create problems during fine-line imaging, solder mask application, and final assembly. One effective way to improve thickness uniformity is through the use of conformal film in the lamination process. A PCB is built from multiple layers of copper, resin, and dielectric materials. During lamination, these layers are pressed together under heat and pressure. If resin flow is uneven, copper areas are unbalanced, or pressure distribution is inconsistent, the final board may show thickness variation.

In PCB lamination and hightemperature release processes, most engineers instinctively focus on peel force, temperature rating, and surface cleanliness. Yet the spec that quietly determines registration accuracy, adhesive squeezeout, and final yield is often low deformation at the XY direction. This is precisely where a good conformal release film earns its place in a layup. Below is a practical breakdown of what this property means, why it matters, and how to validate it on your own line. What Is a Conformal Release Film? A conformal release film is a hightemperature functional film that performs two jobs simultaneously: 1.Conformability – Under heat and pressure, it softens enough to flow into surface topography (stepped circuits, coverlay openings, rigidflex transitions, bumped or molded surfaces), equalizing pressure in the Zaxis without trapping air. 2.Release – Its surface (fluoropolymer, siliconefree modified polyester, or PTFEcomposite) provides controlled, clean detachment from adhesives and resins after cure, leaving little to no residue.

In manufacturing processes such as high-temperature bonding, hot press welding, module packaging, glass hot bending, and lithium battery forming, high-temperature buffer pads serve as a "transition layer" between equipment and workpieces, playing multiple roles such as insulation, cushioning, anti slip, and insulation. Although it is just a "gasket", its material, thickness, structure, and function directly affect product yield, tooling life, and even production line efficiency. Choosing the wrong one not only increases the scrap rate, but may also damage the equipment; Choosing the right one can achieve twice the result with half the effort.

In industries such as electronic manufacturing, display modules, soft board lamination, and lithium battery packaging, hot press bonding is one of the important processes to ensure product reliability and structural strength. However, due to the high temperature, high pressure, and strict requirements for alignment accuracy during the bonding process, even a slight mistake can lead to problems such as indentation, misalignment, blistering, and delamination, seriously affecting product yield. Among all the influencing factors, a commonly overlooked but crucial auxiliary material is gradually entering the field of engineers - high-temperature buffer pads.