In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

As an indispensable part of industrial manufacturing, the control of release film's peeling force has a significant impact on product quality and production efficiency. Correctly understanding and managing the peeling force of release film can effectively avoid material residue and damage, and improve the stability and reliability of production. The peeling force of high temperature release film​ refers to the force required to separate the film material from the mold surface during the manufacturing process. Its main function is to protect the surface of the mold from adhesion of resin or composite materials, thereby ensuring the surface quality and accuracy of the product. The magnitude of the peeling force directly affects the demolding performance and production efficiency of the release film. Excessive or insufficient peeling force may lead to adverse consequences such as material residue or premature demolding.

Release film is a surface treatment material can be used to protect the surface of PCB and prevent resin or composite materials from adhering to the board during the press process. According to different manufacturing processes and application requirements, release films can be divided into various types:

As a key material, release film plays an irreplaceable role in composite material manufacturing. Composite materials are widely used in fields such as aerospace, automotive manufacturing, and construction engineering due to their advantages of lightweight, high strength, and corrosion resistance. As an important auxiliary material in the manufacturing process of composite materials, release film can not only protect the mold surface from adhesion and promote resin curing, but also improve manufacturing efficiency and product quality. This article will delve into the importance of release films in composite material manufacturing, their mechanisms of action, application scenarios, and future development trends.

When discussing the innovative applications of release films​ in semiconductor packaging, we have to delve into how this advanced material plays an important role in key areas of the electronics industry. Semiconductor packaging is a crucial part of the electronic device manufacturing process, which not only involves protecting the integrity of chips and circuits, but also needs to consider multiple factors such as heat dissipation, dust prevention, and moisture resistance. Release film, as a functional material, has demonstrated unique advantages and innovative applications in semiconductor packaging.

As an important component of modern electronic devices, liquid crystal displays (LCDs) are widely used in fields such as smartphones, tablets, televisions, and monitoring equipment. In the manufacturing process of LCD, release film plays multiple important roles, from protection to peeling, ensuring smooth production and improving product quality.

Release films​ are widely used in fields such as electronics, composite materials, and food packaging, especially in many processes that require high-temperature processing. The stability of release films under high-temperature environments is crucial to improve production efficiency and product quality.

Lamination is one of the core steps in the manufacturing of flexible circuit boards. In this process, multi-layer substrates and circuit patterns are laminated and bonded to form a multi-layer structure.Preventing adhesion: The release film is placed between the laminated materials to prevent the layers from sticking together under high temperature and pressure. Ensure flatness: The release film has good flatness, ensuring that the surface of FPC is smooth and wrinkle free. Protective material: Release film can protect the substrate and circuit pattern, preventing damage or contamination during the lamination process. For example, in the manufacturing of multi-layer FPC, release films are placed between each substrate layer to ensure smooth separation of materials during the lamination process.

In modern industrial production, release film has become an essential material and is widely used in fields such as electronics, composite materials, and food packaging. However, the performance requirements for release films vary in different application scenarios, so it is crucial to choose a suitable release film.