In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

The aerospace industry is a field that demands extremely high material performance, especially in the use of composite materials, which must meet stringent quality and technical standards. In the design and manufacturing process of aerospace vehicles, the application of composite materials is becoming increasingly widespread, especially in key parts such as air frames, wings, and engine components. High-temperature release film, as a thin film material that can effectively prevent substance adhesion in high-temperature environments, plays a crucial role in the aerospace industry.

In modern manufacturing, especially in fields demanding high precision and performance such as composite materials, aerospace, automotive, and electronics, high-temperature release films play a crucial role as key auxiliary materials. Their primary function is to prevent adhesion between molds and substrates during high-temperature curing, ensuring that the final product has a smooth and flawless surface. Therefore, selecting the appropriate high-temperature release film becomes a key aspect in enhancing production efficiency and product quality.

With the continuous advancement of industrial technology and the increasing complexity of manufacturing processes, protection solutions in high-temperature environments are also undergoing constant innovation. High-temperature buffer pads, as key protective materials, are widely used in many industries, such as electronics manufacturing, aerospace, automotive manufacturing, and metal processing. Although traditional buffer pads have been able to meet most of the needs in high-temperature environments, with the gradual escalation of working conditions, the industry's requirements for material performance are constantly increasing. To adapt to increasingly demanding high-temperature process conditions, more and more innovative materials have emerged.

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Pi protective film is a high-performance film made of polyimide material.Polyimide is an engineering plastic with excellent thermal stability, high temperature resistance, chemical corrosion resistance, and good electrical insulation, which makes PI protective film irreplaceable in the electronics industry. As a protective material, PI film is widely used in various fields such as circuit boards, semiconductor packaging, battery protection, etc. In the production and use of electronic products, PI protective film provides multiple protections such as physical protection, thermal isolation, and anti pollution for components. Especially in high temperature environments, it can effectively prevent damage to electronic components and ensure long-term stable operation of equipment. With the continuous development of electronic products, especially in smartphones, tablets, automotive electronics, and high-end industrial equipment, the application of PI protective film has gradually become more common and important. It is not only an indispensable component of electronic devices, but also a witness to the continuous progress of modern electronic technology.

With the gradual development of electronic products and precision equipment, the role of protective film materials in modern manufacturing has become increasingly important. Especially in the production process of electronic products, release film, as an important protective material, has become one of the key factors to ensure product quality and integrity. PACOPLUS, as a high-tech material with excellent performance, is increasingly being applied in the production and packaging of electronic products in various industries, greatly improving the protection efficiency of products and the accuracy of the production process.

In the production process of composite materials, how to effectively reduce negative environmental impacts while improving production efficiency remains a key challenge for many enterprises. Traditional manufacturing processes often employ silicon-based release films, which, despite their excellent releasing performance, present certain limitations in terms of environmental friendliness and production efficiency. In recent years, ultra-lightweight non-silicone release films have emerged as an innovative solution, gaining prominence in the composite materials industry for the environmental benefits, and superior performance—making them a vital tool for enhancing production efficiency and achieving green manufacturing.

In the manufacturing process of solar panels, improving production efficiency and reducing costs remain key challenges for the industry. In traditional production processes, the release film used usually relies on silicon materials. Although this type of film can effectively prevent adhesion during the production process, there are certain issues in terms of production efficiency, cost control, and environmental protection.