In order to cooperate with the novel coronavirus pneumonia epidemic prevention and control work of the Shanghai Municipal Government and effectively ensure the health, safety and exhibition effect of exhibitors and visitors, after careful assessment, the "2022 International Electronic Circuit (Shanghai) Exhibition" originally scheduled to be held in the National Convention and Exhibition Center (Shanghai) from September 13 to 15, 2022 will be postponed and the venue will be changed to October 12-14, 2022, The venue was changed to: Shenzhen International Convention and Exhibition Center (Bao'an District). The tentative name of the exhibition is "2022 International Electronic Circuit (South China) Exhibition". The adjustment of the exhibition time and location will bring you

In view of the recent outbreak in Shenzhen, in order to cooperate with epidemic prevention and control work, the organizing committee has fully listened to the opinions of various departments, and after repeated discussions and careful consideration, decided that the 20th International Electronic Circuit (Shenzhen) Exhibition, originally scheduled to be held from July 5-7, 2022, will be postponed to December 7-9, 2022, with the venue unchanged. The organizing committee has always prioritized the health and safety of exhibitors and visitors while preparing for this industry representative event. We deeply apologize for the inconvenience caused by the exhibition delay. Sincerely thank you for your strong support and trust in the exhibition during this difficult period

Distinguished exhibitors and partners: In view of the severe episodic situation throughout the country, the episodic prevention department of Shenzhen International Holdings has recently increased the episodic prevention and control measures In order to fully cooperate with the requirements of the empirical prevention department, the Organizing Committee returns to announcement that the "HKPCA Show" originally scheduled to be held in Shenzhen International Convention and Exhibition Center (Bao'an) on December 7-9, 2022 will be posted, and the specific time will be notified later We sincerely thank the participating enterprises, industry associations, and partners who have strongly supported and trusted the exhibition during this difficult period Please make corresponding adjustments and arrangements according We will

The HKPCA Show, one of the largest and most influential circuit board and electronic assembly exhibitions in the world, will return to China in May and December 2023, It will be held in Shenzhen International Holdings International Convention and Exhibition Center (Bao'an) on May 24-26 and December 6-8 respectively! Gathering innovative equipment and technology to help capture unlimited business opportunities Over the past two decks, global PCB production

High temperature release films are widely used in high-precision industries such as electronic manufacturing, semiconductor packaging, lithium battery production, and optical device manufacturing. Different application scenarios have different requirements for the substrate type, temperature resistance, surface treatment, etc. of high-temperature release films. Therefore, it is crucial to choose a suitable high-temperature release film reasonably. The substrate determines the key properties of high-temperature release film, such as temperature resistance, mechanical strength, and chemical corrosion resistance. At present, common high-temperature release film substrates include PET (polyester), PI (polyimide), PTFE (polytetrafluoroethylene), PPS (polyphenylene sulfide), etc. Each material has different characteristics and is suitable for different industry needs.

High temperature release films are widely used in high-precision industries such as electronic manufacturing, semiconductor packaging, lithium battery production, and optical device manufacturing. Different application scenarios have different requirements for the peeling force, substrate type, temperature resistance, surface treatment, etc. of high-temperature release films. Therefore, it is crucial to choose a suitable high-temperature release film reasonably. Peel strength is one of the core indicators for selecting high-temperature release films, usually divided into three types: light release, medium release, and heavy release. The choice of peeling force affects the stability of processes such as die-cutting, lamination, pressing, and protection. Excessive or insufficient peeling force can affect the quality of the final product.

The heat resistance and peel stability of high-temperature release films largely depend on the choice of their substrate. Common high-temperature-resistant substrates include PET (polyester), PI (polyimide), PTFE (polytetrafluoroethylene), and PPS (polyphenylene sulfide), among others. The differences in physical and chemical properties of these materials determine their suitability for various application scenarios. PET (Polyester): Common and cost-effective, with a heat resistance of 120-200°C, but may experience deformation and embrittlement under prolonged high temperatures. PI (Polyimide): Heat-resistant up to over 300°C, featuring excellent electrical insulation and chemical corrosion resistance, making it the preferred choice for high-end electronics and semiconductor industries.

With the continuous upgrading of global manufacturing, smart manufacturing has become the core driving force behind the development of Industry 4.0. In particular, in high-precision manufacturing fields such as PCB (printed circuit board) production, semiconductor packaging, and display panel manufacturing, traditional lamination processes are evolving toward automation and intelligence. As a key auxiliary material in lamination processes, the role and function of buffer pads in smart manufacturing environments.

Buffer pads are essential auxiliary materials in high-precision industrial manufacturing processes such as PCB manufacturing, semiconductor packaging, and display panel production. It plays an important role in the lamination process, such as buffering pressure, uniform heat conduction, and reducing stress concentration. However, many companies have shortened the service life, decreased performance, and even affected product quality of buffer pads due to improper use or improper maintenance during the production process.

In precision manufacturing industries such as PCB, semiconductor packaging, and display panels, lamination process is a key factor in determining product quality. However, common issues during the lamination process, such as board warping, interlayer delamination, bubbles, and uneven resin flow, seriously affect production yield and increase production costs. As a key auxiliary material in the lamination process, buffer pads play an important role in optimizing pressure distribution, improving thermal conductivity, and reducing stress concentration.

In the process of manufacturing PCB, FPC and other precision industries, press pads are important auxiliary materials for thermal compression bonding processes. It not only affects the uniform distribution of pressure, but also determines the heat conduction effect, lamination stability, and finished product quality. Therefore, how to choose the appropriate press pad has become a key issue of concern for PCB manufacturers, electronic packaging companies, and other related industries. For standard PCB manufacturing, paper pads are more common due to their economic and disposable characteristics. For high-end PCBs such as HDI and multi-layer boards, rubber press pads and aramid fiber pads are better choices because they can provide better pressure dispersion and thermal conductivity performance. For 5G, IC carrier boards, and high-frequency high-speed PCBs, graphite press pads have become the mainstream choice due to their superior thermal uniformity, which ensures higher production yield.

In the manufacturing process of printed circuit boards (PCBs), the lamination process of multilayer boards is crucial. As a key step in connecting the circuits of each layer, the quality of lamination directly determines the reliability, stability, and electrical performance of the final product. During this process, the press pad/cushion pad plays an indispensable role, as it not only affects the uniform distribution of pressure and temperature but also directly influences the flatness and interlayer bonding strength of the PCB.